Thermal pad placement in enclosure for Odrive Pro

Hi, I just received The Odrive Pro and the aluminium enclosure for it. In the package, I also received some screws, wire and a green piece of “tape” measuring 16 x 53 mm. What is this green piece used for? Should it be placed on the 12 power mosfets on the board as isolation?

You’re right that the green pad is a thermal pad. It should be placed sticky side down on the heat sink, and the pad portion against the MOSFETs (on the other side of the PCB from the capacitors). Then when the Pro is screwed into the heat spreader plate / enclosure, the FETs should make contact / squish the pad a bit.

Thank you!